Social Recruitment

Position Requirements:

1.Proficient in digital circuits, Verilog syntax, and RTL design methodology.

2.Ability to complete designs according to specifications and build FPGA platforms for verification.

3.Basic C software development skills.

4.Experience in peripheral interface verification (e.g., UART, I2C, SPI).

5.Preferred Qualifications: Tape-out experience; knowledge of digital filter design is a plus.

6.Bachelor's degree or above with 2-3+ years of relevant work experience.

Job Responsibilities:

1.Engage in design and verification of digital IC products or IP modules.

2.Develop detailed product specifications based on project outlines.

3.Allocate tasks according to product development timelines and prepare technical documentation.

4.Collaborate with testing teams to validate IC functionality and performance via verification platforms, identifying issues and proposing improvements.

5.Analyze product issues and optimize performance.

6.Oversee product version optimization and modification.

7.Complete ad-hoc tasks assigned by supervisors.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Position Requirements:

1.Associate degree or above in Test & Measurement, Electronic Engineering, Microelectronics Technology, or related fields.

2.Minimum 2 years of relevant experience; familiarity with IC production testing processes. Testing facility experience preferred.

3.Experience in mixed-signal/driver product maintenance/development is advantageous.

4.Proficient in at least one ATE platform and related development environments (C++ required). Three-temperature testing equipment experience is a plus.

5.Detail-oriented with strong hands-on problem-solving skills.

6.Excellent communication, teamwork, and independent analytical abilities.

Job Responsibilities:

1.Prepare and maintain hardware for chip mass production testing.

2.Release and maintain mass production test programs.

3.Validate test solutions for different packaging types; assist test engineers in new product ramp-up.

4.Support test hardware/software updates for packaging changes, test plan adjustments, or platform transitions.

5.Drive new product testing integration, engineering batch analysis, top failure analysis, yield analysis, and improvement.

6.Investigate and resolve hold lot issues; propose and implement corrective actions.

7.Monitor test yields and SYL/SBL metrics; perform data analysis for yield enhancement.

8.Optimize test UPH (Units Per Hour), reduce cycle time, and improve test stability.

9.Track production output and analyze test data to support yield improvement and failure analysis.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Position Requirements:

1.Bachelor’s degree or higher in Microelectronics or related field; 5+ years of experience in high-voltage BCD process design.

2.Deep understanding of integrated circuit device principles and fabrication processes.

3.Proficient in analog layout matching rules, noise shielding, and ESD/latch-up design principles.

4.Hands-on experience with full-cycle IC layout design and tape-out for multiple chips.

5.Strong communication skills and team spirit.

6.High sense of responsibility, meticulous work ethic, and ability to work independently.

7.Fluent in English (listening, speaking, reading, writing).

Job Responsibilities:

1.Execute layout design per circuit designer requirements and specified process rules.

2.Optimize layouts for performance, cost, testability, and packaging feasibility.

3.Oversee DRC/LVS verification for designed products.

4.Familiarity with BCD/Bipolar/CMOS/BiCMOS IC manufacturing processes.

5.Layout optimization, data export, and product documentation preparation.

6.Packaging drawing preparation.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Position Requirements:

1.Bachelor’s degree; background in Electronic Information Engineering preferred.

2.Experience in new media operations.

3.Proficient in PowerPoint; knowledge of video editing software (e.g., Premiere, Final Cut) is a plus.

4.Strong communication skills with an outgoing personality.

Job Responsibilities:

1.Lead marketing campaigns for new product launches, including: Creating PowerPoint presentations, Drafting promotional articles, Editing short videos, Developing content for official WeChat accounts.

2.Manage media outreach to distribute promotional materials across industry-related platforms.

3.Organize exhibition preparations, including: Selecting appropriate trade shows, Designing promotional posters, Coordinating booth setup, Tracking client data and engagement.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Position Requirements:

1.Bachelor’s degree or higher in Communication Engineering, Automation, Electronic Information, Semiconductor, or related fields.

2.Proficient in PCB design software (e.g., Altium Designer, Cadence) with the ability to independently complete schematic design and PCB layout.

3.Skilled in using standard instruments such as oscilloscopes, multimeters, and logic analyzers.

4.Strong communication skills, passion for challenges, and a proactive attitude toward continuous learning.

5.Excellent problem-solving and analytical abilities, sense of responsibility, and willingness to learn new technologies.

6.Priority given to candidates with: 2+ years of hardware/software development experience, or 2+ years of FAE/AE (Field/Application Engineer) experience at a chip manufacturer.

7.CET-4 certification or equivalent, with fluency in reading/writing technical documents in English.

Job Responsibilities:

1.Collect, process, provide feedback on, and track customer technical issues to ensure effective support.

2.Identify new customer projects, understand requirements, and collaborate with sales to achieve design-in success.

3.Provide on-site technical support and product maintenance.

4.Stay updated on company products, technologies, and industry trends.

5.Deliver technical training to internal teams and partners, and create technical/applications documentation.

6.Analyze product applications and emerging technologies to assist in defining new product requirements.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.

Position Requirements:

1.Bachelor’s degree or higher in Microelectronics or related fields.

2.Proficient in integrated circuit device principles and familiar with semiconductor manufacturing processes.

3.Passionate about IC layout design and committed to pursuing a long-term career in this field.

4.Strong communication skills and a collaborative team spirit.

5.High sense of responsibility with the ability to work independently.

6.Excellent English proficiency in listening, speaking, reading, and writing.

(Compensation negotiable for candidates with prior work experience.)

Job Responsibilities:

1.Design layouts based on circuit designers’ specifications and comply with designated process rules.

2.Optimize layouts for performance, cost, testing feasibility, and packaging compatibility.

3.Perform DRC (Design Rule Check) and LVS (Layout vs. Schematic) verification for designed products.

4.Optimize layouts, generate output data, and complete product documentation.

5.Prepare packaging drawings.

6.Minimum 2 years of relevant work experience.

Other:

Competitive Benefits Package:

Competitive salary + Weekends off + Social insurance & housing fund + Meal allowance + Quarterly performance bonus + Annual bonus + Annual company trip + Regular health check-ups+ Occasional recreational/sports activities

Comprehensive Leave System：

Paid annual leave + Statutory holidays+Paid leave for sickness, marriage, maternity, etc.